Cantilever Probe Cards

Existing probe card technologies are generally very expensive and best suited for engineering lab as they lack the fiability required for production use.

However, Synergie Cad Probe combines PCB design and probe assembly technologies to minimize the resistivity and noise to test up to 10Ghz in production environments.

Downoload the request probe card order form

Cantilever Probe Cards Standard

Standard Epoxy Cantilever
Probe Card

This Probe card technology is used for logic, analog, memory applications

 Cantilever Probe Cards Multidie

Multi-Die Epoxy Cantilever
Probe Card

64, 128 or 256 Duts
Cantilever Probe Cards Multisquare

Multi Square Cantilever
Epoxy Probe Card

Multie-Die Testing. Enables test 2x2, 1x2, 1x3, 1x4 ...

 Cantilever Probe Cards Finepitch

Fine Pitch Epoxy
Cantilever Probe Card

Support fine pitch down to
35µm
Cantilever Probe Cards Special Soldering

Special Soldering and
wiring

Baby Board, Coax cable,
Interface

 Cantilever Probe Cards Imager

Imager Epoxy Cantilever

Probe card to test CCD
Semiconductors. Wild area: IE 10 x 10 cm
Cantilever Probe Cards Imager Simple Align

Imager Simple align Epoxy

Cantilever Probe card test CCD semiconductors

 Cantilever Probe Cards Memory

Memory Probe Card
Cantilever Probe Cards LSI

LSI Probe Card

 Cantilever Windowless

Windowless®
Cantilever Probe Cards LDI

LDI Probe Card

e6819 Test Keithley Top

E6819 Keithley probe card

Cantilever Windowless

Special Application

 Cantilever Windowless

Probe Card XXL



Cantilever Probe Cards Cantimager

Canti Imager

Synergie Cad Probe offers an innovative solution to test CCD in parallel 4x2

You can download this brochure about Canti Imager

Cantilever Probe Cards Cantimager

Canti RF®

Please contact us at info@synergie-cad-probe.fr to get more information about these products

You can download this brochure about Canti RF®
Cantilever Probe Cards Cantimager

Canti Bump

Please contact us at info@synergie-cad-probe.fr to get more information about these products

Parametric cards

S600 Ultra Low leakage probe card Logo

  • 1fA/V pin to pin leakage
  • Electrical test and report on Keithley tester
  • Ceramic blades or coax-epoxy
  • Fully qualified by Keithley Instruments
  • Temperature : up to 200°C in coax epoxy
  • Pitch: 85 μm
  • Pads: 50x50μm²
  • New: High Voltage solutions

S400 Low leakage probe cards Logo

  • 0.1pA/V pin to pin leakage
  • Electrical test and report on Keithley tester
  • Ceramic blades or epoxy ring
  • Up to 200°C
  • Pitch: 85 μm
  • Pads: 50x50μm²
Parametric

4072-4082 Ultra Low leakage probe card Logo

  • 1fA/V pin to pin leakage
  • Electrical test and report on B1500 Agilent’s tester
  • Coax-epoxy
  • Temperature: up to 200°C in coax epoxy
  • Pitch: 85 μm
  • Pads: 50x50μm²

4071 Low leakage probe cardsLogo

  • 0.1pA/V pin to pin leakage
  • Electrical test and report
  • Ceramic blades or epoxy ring
  • Up to 200°C
  • Pitch: 85 μm
  • Pads: 50x50μm²
Parametric

  S400 S600 S4073 406x, 407x
Probe Card  
Typical Probe Card Depth
( from Bottom )		 120 -160 mils +/- 5 80 -250 mils +/- 5
Minimum Pitch 80 μm
Minimum Pad dimensions 50 μm
Tip position in line
Number of probes 1-64 1-60
Probe position alignment accuracy +/- 5 μm
Operating temperature -40°C to 200°C
Rotational specification +/-1°
Typical Overdrive 3 mils
Typical touchdown 250 000 to 1 000 000

  S400 S600 S4073 406x, 407x
Needles  
Type Ceramic Blades, Coaxial Epoxy needles, standard needles Strip line Ceramic Blades, Coaxial Epoxy needles Coaxial Epoxy needles Ceramic Blades,
Coaxial Epoxy needles,
standard needles
Material Copper Beryllium or Tungsten Rhenium
Tip diameter 1 to 2 mils ( 25 to 50 μm) 0.3 to 2 mils (8 to 50 μm)
Tip length 7 to 25 mils (175 to 625 μm)
Planarity +/- 5μm

  S400 S600 S4073 406x, 407x
Pad specification  
Material Aluminum, Copper, Polysilicon, other
Flatness between 2 pads +/- 10μm
Probe mark dimensions 30 to 60 μm

  S400 S600 S4073 406x, 407x
Electrical Specifications  
Leakage: Pin to Ground , Pin to Pin 0.1 pA/V 0.2 pA/V
1 fA/V
 1 fA/V @ 10s
10 fA/v @ 1s		 1 pA/V
0.1 pA/V
1 fA/V
Maximum current per pin
(depending on material tested )		 Depending on needle dimension and material from 300mA to 1.5A
Typical parasitic capacitance NA
Typical DC contact resistance
( Probe )		 0.5 to 1 ohm
Maximum DC contact resistance
( Tip to Test equipment )		 2 Ohms +/- 1

  S400 S600 S4073 406x, 407x
PCB specification

  
Material Polyimide, Pcb Kit provided and guaranteed by Keithley FR4, Polyimide
Thickness 3.2 mm Double deck probe cards
3.2 mm with gold pins plugs		 3.2 mm 1.6 or 3.2 mm
Components pre-mounted   ID EEprom    

To get more information about theses products, you can download the brochure on parametric cards, or especially on S600, S400, 4073, 406x and 407x.

Visit the website of Keithley and Agilent to know their products, and download the newsletter about the new Agilent tester for parametric products.

You can also download the request form Agilent.

Blade Technology

Blade card technology is engineered for applications that require low pin counts.
The technology excels in applications requiring low leakage, high frequency and high
temperature.

Blade card has no ring assembly. Rather, each probe is mounted on separate blade.

These Blades are individually soldered on to lands.



 Blade
Blade

The most commun types of Blades are:

Standard Blade:

Standard Blade Probes are used in applications that don’t require a controlled impedance,
the signal path connect directly on PCBPad pitch must be greater than 120µm.
Number of pins must be less than 80 with pads must be symmetrically.

 Blade Standard

Radial Microstrip:

Radial Microstrip Blades are designed of impedance applications, the signal patch connect directly to coaxial cable.

 Blade Radial

Microstrip Blade:

Microstrip blades are designed for RF applications these probes support a test speed greater than 3 GHz.
Bandwidth is greater than 3 GHz.
Leakage specification is less than 1 PA/V.

 Blade Microstrip

Low current technology Ceramic Blade Specification

The low leakage and low noise characteristics of these assemblies provide the measurements down to 400FA.

Leakage:

Keithley S600 =  50 fAmps @ 1 Volts
HP 4062          < 1 pAmps  @ 1 Volts
HP4070 Series  < 1pAMPS @ 1 Volts
Blade

Download the request vertical order form

Verti-B

To get more information about these products, you can download the brochure on the VertiB.

Download the request vertical order form

Contact us at info@synergie-cad-probe.fr.

To get more information about these products,contact us at info@synergie-cad-probe.fr.

Verti-B

Download the request vertical order form

To get more information about these products,contact us at info@synergie-cad-probe.fr.

T78

Download the request vertical order form

To get more information about these products,contact us at info@synergie-cad-probe.fr.

Technology under development

To get more information about these products,contact us at info@synergie-cad-probe.fr.

Verti-C

Verti-C

Download the request vertical order form

To get more information about these products,contact us at info@synergie-cad-probe.fr.

Printed Circuit Board (PCB)

PCB

To get more information relating to PCB, you can download our request PCB order form or visit the site of the head office: www.synergie-cad.fr
Contact: Alain Librati - a.librati@synergie-cad.fr
Eric Viguier - e.viguier@synergie-cad.fr
Synergie Cad
ZI 1° Avenue - 2° Rue BP 423
06515 Carros, France

Tel : +33 (0)4 93 08 25 25
Fax : +33 (0)4 93 29 13 98
EMail : info@synergie-cad.fr 		logo

Printed Mother Board (PMB)

Synergie Cad Probe designs and manufactures a diversified product line of MotherBoards. MotherBoards are used in relation with probe card analyzer.

To get more information about theses products, you can contact the company at info@synergie-cad-probe.fr, download this brochure, or download the Motheboard request order form.

List of Mother Board (available):
PMB

Special Interfaces

To get more information about these products, download our brochure or please contact us at info@synergie-cad-probe.fr.

Special Interface

 

Development of products for testing the pression sensors:

Special InterfaceSpecial Interface

 

Mechanical interface and cable:

Mechanical Interface

 

Interface for Handleur:

Interface for Handleur

 

Interface for Applied:

Interface for Applied

 

Chuck thermique:

Chuck thermique

 

Banc ISO:

Banc ISOBanc ISO

Socket list

  • BGA
  • QFN
  • PLLC
  • LDFP
  • TQFP
  • BCC
  • LGA
  • SOIC
  • MLP / MLF
  • Others
 Socket

Assembly Final Test

Socket

Download the request test socket order form

To get more information about these products, download this brochure or please contact us at info@synergie-cad-probe.fr.

Socket

Stiffener

Stiffener

Container

Circle Container:

Square Container:

Probe Tip Protector:

 products_container

Download the catalog of standard containers

To get containers with other dimensions,
please contact us at info@synergie-cad-probe.fr

Connectors

Synergie Cad Probe provides connectors to plug in on several motherboards:

  • SCP34P5LL
  • SCP34PSR

To get information about other connectors, please contact us at info@synergie-cad-probe.fr

To get more information, please contact us at info@synergie-cad-probe.fr.

Download the brochure on the cleaning bmc

To get more information about these products, please contact us at info@synergie-cad-probe.fr

Probe Needle Materials

Overview:
There are several common needle materials used. The choice of which to use is determinated by technical requirements.

Probe

Tungsten (W):
Tungsten is the common probe material. The most valued characteristic of this material is its ability to survive at least several hundred thousand probing cycles.
Contact resistance can be quite low, the striation of the material generated a pollution who increase the contact resistance.This necessitates cleaning of the tip, which is most often done mechanically. Suitable for bond pad of aluminium.

Tungsten Rhenium (ReW):
97%Tungsten, 3% Rhenium.
Tungsten Rhenium 10% stronger in hardness than Tungsten, less surface oxidization at High Temperature, Higher spring force, suitable for bond pads of aluminium.

Beryllium Copper (BeCu):
It is a homogenous material that maintains a smooth tip.Faeture less contact resistance at lower contact pressure. Reduced hardness and resistance to wear. Main application for bond pads of Au and Gold.

Palladium Alloy:
Paliney is a trade name for this material. This material has many noble metal ( Gold, Palladium, Platinium, Silver, Copper, Zinc) constituents which lead to its giving the lowest contact resistance readings in a given application. This is one of the most expensive probing materials.

  Paliney® 7 (Pal 7)
  Paliney® 6 (Pal 6)
Needle

Cantilever Technology Probe

A variety of factors should be considered when choosing a probe needle:

Low Frequency (DC) Testing

Low Current Applications
Isolation
Leakage

High Current Applications
Power Dissipation
Series Resistance

 Cantilever technology Probe

High Frequency (AC) Testing
Inductance
Probe Impedance
Crosstalk

Probe Needle Life
Contact Resistance

 Cantilever Technology Probe

Cantilever Specification:

Cantilever Specification

Current capacity can be multiplied by 5 for 0.5 sec pulses and 10 for 50 millisecond pulses.

Properties of Probe Wire

Properties

Probe Pressure:

Formule

Definitions:
W : Probe pressure (g), L : Beam length (mm)
D : Probe diameter, δ : Overdrive amount (mm)
E: Young's modulus(N/mm²)
β : Attenuation constant depending on tapers and shapes

 Probedraw

Probe Wire diameter:
Wire diameter has the most significant effect on contact force and pad pitch. It's usually expressed in mils, depending on the materials used. The probe car designer determines the wire diameter to be used.

Etch length:
The probe car designer determines the etch length to be used. It's definied as the distance from the point where diameters begins to descrease to the tip of the probe.

Bend Angle:
The bend Angle, which is expressed in degrees. The probe card designer determines the value. The size of the angle used will determine the quality of the scrub mark.

Tip length:
Probe tip length is measured from the tip of the probe to the bend in the probe and is expressed in mils. The probe cards designer determines tip length.

Tip diameter:
Probe tip diameter affects the contact resistance of the tip and damage to the pad.

Beam length:
On standard probe car designs, the beam length is dictated by the die size. The probe card designer chooses the beam length to meet contac force requirements.

Probing Alignment Analyzer
SAMX.9 (European Market) or SAMv11 (US Market)

Synergie Cad Probe has developed a new equipment which allows a location check of various pins with an integrated program. The software allows an easy recording of the measurement data, as well as their exploitation and their evaluation.

You can download our presentation about this equipment in the SWTW 2011 at San Diego.

To get more information about this device, download our brochure or please contact us at info@synergie-cad-probe.fr.

John P Kummer is the distributor of the SAMX.9 and the SAMv11
Please visit their website or contact John P Kummer for more information.		 Company Logo Kummer

Special Test Equipement

Synergie Cad Probe has developed a new Test Equipement for Foil. To get more information about this device, please contact us at info@synergie-cad-probe.fr

ORGAPHODE

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